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Mechanical Considerations
7.2.1. Top mounting
For top mounting heatspreaders with non-threaded standoffs (bore hole) are used.
This variant of the heatspreader was designed to be used in a system where the heatspreader
screws need to be inserted from the top side of the complete assembly. In this case the threads
for securing the screws are in the Carrier Board's standoffs. This is the reason why the
heatspreader must have non-threaded (bore hole) standoffs.
Figure 76: Complete assembly using non-threaded (bore hole) heatspreader
Note The torque specification for heatspreader screws is 0.5 Nm.
Caution Do not use a threaded heatspreader together with threaded Carrier Board
standoffs. The combination of the two threads may be staggered, which could
lead to stripping or cross-threading of the threads in either the standoffs of the
heatspreader or Carrier Board.
PICMG
®
COM Express
®
Carrier Board Design Guide Rev. 2.0 / December 6, 2013
196/218
HSP stand-off
(Ø2.7mm bore hole)
Baseboard stand-off
(M2.5 thread)
Carrier board
COM Express Module
Heatspreader (HSP)
M2.5 Screw
and Washer
- COM Express® 1
- Carrier Design Guide 1
- Contents 3
- 1. Preface 8
- 1.6. Name and logo usage 9
- 1.7. Intellectual property 10
- Term Description 11
- 1.10. Schematic Conventions 15
- 2. COM Express Interfaces 16
- COM Expre ss Module 17
- Type 10 17
- Table 4: Pin-out Comparison 20
- , the PCI 30
- 2.3.5. Schematic Examples 34
- Signal Pin Description I/O 45
- Figure 15: ExpressCard Size 45
- 2.4.1. Signal Definitions 48
- 2.4.2. PEG Configuration 49
- 2.4.3. Reference Schematics 52
- DisplayPort is supported 55
- DisplayPort Example 56
- Figure 21: HDMI Example 57
- Figure 22: DVI Example 59
- SDVO Port Configuration 61
- Supported SDVO Devices 62
- DVI_SDAROM 63
- DVI_SCLROM 63
- SDVO I2C Bus Address 63
- Write = 0111 0000 (70h) 63
- Read = 0111 0001 (71h) 63
- 2.6.1. Signal Definitions 66
- Earliest asserted 1ms after 68
- 3.3V, 5V and 12V are stable 68
- 2.7. LAN 70
- 2.7.2. Reference Schematics 73
- 2.8. USB Ports 76
- 2.8.2. Reference Schematics 77
- 2.9. USB 3.0 81
- 2.9.1.3. USB 3.0 connector 83
- 2.9.2. Reference Schematics 84
- 2.10. SATA 87
- Pins Signal Description 88
- SATA Port 89
- 2.11. LVDS 91
- Term Definition 94
- 2.11.2. Reference Schematics 97
- 2.12.1. Signal Definitions 99
- 2.12.2. Reference Schematics 100
- 2.13. VGA 101
- COM Express Interfaces 102
- 2.14. TV-Out 104
- COM Express Module 106
- AUDIO POWER 107
- AUDIO CODEC - ALC888 107
- ANALOG I/O CONNECTOR 107
- 2.15.1.2. AC'97 108
- Figure 41: Audio Amplifier 109
- 2.16.1. Signal Definition 111
- SUPER I/O 115
- COM1/COM2 116
- 2.17.1. Signal Definition 118
- 2.18.1. Signal Definitions 121
- 2.18.2. Reference Schematics 121
- 2.19.1. Signal Definitions 123
- 2.20.1. Signal Definitions 125
- C O M 1 C O M 2 126
- 2.21. CAN Interface 127
- 2.21.2. Reference Schematics 128
- 2.22. Miscellaneous Signals 129
- POWER ATX 133
- POWER AT 133
- Type 2 Detection 133
- 2.22.5. Watchdog Timer 137
- G P IO C o n n e c t o r 141
- 2.22.8. Fan Connector 142
- 2.22.9. Thermal Interface 143
- 2.23. PCI Bus 147
- 2.23.2. Reference Schematics 148
- 2.24.1. Signal Definitions 153
- 3. Power and Reset 156
- 3.2.1. ATX vs AT Supplies 157
- 3.2.2. Power States 157
- Power and Reset 158
- 3.2.5. Power Button 162
- 3.4. Reference Schematics 164
- Table 55: ATX Signal Names 166
- ATX Signal Name Description 166
- 3.5. Routing Considerations 167
- 3.5.3. VCC5_SBY Routing 168
- 4. BIOS Considerations 170
- Type Height Partnumber Note 171
- COM Express Module Connectors 172
- GND Plane 173
- Power Plane 173
- COM Express 175
- Table 60: Trace Parameters 176
- Symbol Definition 176
- Carrier Board 178
- Parameter Trace Routing 183
- Extended 194
- 7.2. Heatspreader 195
- (Ø2.7mm bore hole) 196
- (M2.5 thread) 196
- (Ø2.7 bore hole) 197
- Mechanical Considerations 198
- 8.3. Useful books 202
- 9.1. TV-Out 203
- 9.1.5. Signal Termination 206
- 9.1.6. Video Filter 206
- 9.1.7. ESD Protection 206
- 9.2. LPC Firmware Hub 207
- Appendix C: List of Tables 213
- Appendix D: List of Figures 215
- Table 79: Revision History 217
- Revision Date Author Changes 217
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