COMe-mSP1 / Features and Interfaces
4.8 K-Station & API Resources
4.8.1 I2C
BUS Function
I2C 0 External / JIDA I2C
I2C 1 SM-Bus
I2C 2 SDVO DDC
I2C 3 JILI DDC
4.8.2 Storage
Device Function
EEPROM 0 JIDA EEPROM Area1 with 32 Bytes (free to use)
4.8.3 GPIO
Port Function
IO-Port 0 GPI0 Port, Bit 0-3: Input, Bit 4-7: Output Direction Change possible with NOW1R117 and CE 4.6.0 or newer
4.8.4 Hardware Monitor
Sensor Function
Temp 0 Module Temperature (internal IC temperature of onboard Winbond W839771 HWM)
Temp 1 CPU ACPI Temperature (measured with Winbond W839771 HWM))
Temp 2 External SIO Winbond 83627 Temp Sensor 1)
Temp 3 External SIO Winbond 83627 Temp Sensor 2
Temp 4 External SIO Winbond 83627 Temp Sensor 3
FAN 0 External SIO Winbond 83627 FAN Sensor 0
FAN 1 External SIO Winbond 83627 FAN Sensor 1
FAN 2 External SIO Winbond 83627 FAN Sensor 2
Voltage 0 External SIO Winbond 83627 Voltage Sensor 0: CoreA
Voltage 1 External SIO Winbond 83627 Voltage Sensor 1: CoreB
Voltage 2 External SIO Winbond 83627 Voltage Sensor 2: 3.3V Battery
Voltage 3 External SIO Winbond 83627 Voltage Sensor 3: +3.3V
Voltage 4 External SIO Winbond 83627 Voltage Sensor 4: +5V
Voltage 5 External SIO Winbond 83627 Voltage Sensor 5: +5V_SB
Voltage 6 External SIO Winbond 83627 Voltage Sensor 6: +12V
Voltage 7 External SIO Winbond 83627 Voltage Sensor 7: -5V
Voltage 8 External SIO Winbond 83627 Voltage Sensor 8: -12V
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