Kontron COMe-cDC2 Instrukcja Użytkownika Strona 27
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COMe-cDC2 / Features and Interfaces
4 Features and Interfaces
4.1 Onboard SSD
The COMe-cDC2 features an onboard Greenliant PATA NAND flash drive with capacities of 512MB to 8GB SLC (PATA). Due to
performance and longevity reasons standard variants with onboard flash use SLC type only. The following PATA NANDrives
are available:
Basic features of the PATA NANDrives
» 16-bit ATA/IDE Bus Interface with PIO Mode-6, Multi-Word DMA Mode-4 and Ultra DMA Mode-4
» RoHS compliant NAND flash type
» Hardware error detection and correction ECC
» Advanced wear leveling
» Bad block management
SLC NANDrive™
Flash Part No. GLS85LP0512P-S-I-LBTE GLS85LP1002P-S-I-FTE GLS85LP1004P-S-I-FTE GLS85LP1008P-S-I-FTE
Temperature Range
-40°C to +85°C -40°C to +85°C -40°C to +85°C -40°C to +85°C
Flash Size 512MB 2GB 4GB 8GB
NAND Type
SLC NAND SLC NAND SLC NAND SLC NAND
Sustained Read Speed
25 MB/s 28 MB/s 50 MB/s 50 MB/s
Sustained Write Speed
6 MB/s 11 MB/s 20 MB/s 39 MB/s
Total Bytes
456,744,960 2,000,388,096 4,068,384,768 8,136,769,536
Max LBA
892,080 3,907,008 7,946,064 15,892,128
Cylinders/Heads/Sectors
885/16/63 3,876/16/63 7,883/16/63 15,766/16/63
Active Mode Power
200mW 200mW 265mW 365mW
Program/Erase Cycles per Block
100k 100k 100k 100k
(Data based on GLS85LPxxxxP Datasheet Rev. 02.000 from 06-2012)
The NAND Flash types listed above are available on COMe-mSP1 hardware revision CE4.7.0
and COMe-cDC2 hardware revision CE 2.4.1 or newer. Please contact your local sales or
support for Flash specifications of SST Flash used on older revisions
27
- COMe-cDC2 1
- » Table of Contents « 3
- 1 User Information 6
- 1.5 Warranty 7
- 1.6 Technical Support 7
- 2 Introduction 8
- 2.5 COM Express® Benefits 9
- 3 Product Specification 10
- Accessories 11
- 3.2 Functional Specification 12
- Connectivity 13
- Misc Interfaces and Features 14
- Kontron Features 14
- Power Features 14
- Supported Operating Systems 14
- 3.3 Block Diagram 15
- 3.4 Electrical Specification 16
- 3.4.5 ATX Mode 17
- 3.4.6 Single Supply Mode 17
- 3.5 Power Control 18
- 3.6.2 Humidity 19
- CE marking 20
- WEEE Directive 20
- Conformal Coating 20
- Shock & Vibration 21
- 3.8 MTBF 22
- 3.9 Mechanical Specification 23
- 3.10 Thermal Management 24
- 3.11 Heatspreader 24
- 3.12 Onboard Fan Connector 25
- 4 Features and Interfaces 27
- 4.2 S5 Eco Mode 28
- 4.4 LPC boot 30
- 4.5 M.A.R.S 31
- 4.6 Fast I2C 32
- 4.7 JIDA16 and JIDA32 33
- 4.8 K-Station 1 34
- 4.9.1 I2C 35
- 4.9.2 Storage 35
- 4.9.3 GPIO 35
- 4.9.4 Hardware Monitor 35
- 4.10.1 I2C 35
- 4.10.2 Storage 36
- 4.10.3 GPIO 36
- 4.10.5 SIO Winbond 83627DHGP 36
- 4.10.6 SIO Winbond 83627HG 37
- Configuration 38
- Time-out events 39
- WDT Signal 39
- 4.13 Flash Backup Feature 40
- 4.14 Speedstep Technology 42
- 4.15 C-States 43
- 4.16 Hyper Threading 44
- 5 System Ressources 46
- 5.3 Memory Area 47
- 5.4 I/O Address Map 48
- 5.7 JILI I2C Bus 48
- 6 Connectors 49
- 6.2 Pinout List 50
- 6.2.2 Connector X1A Row A 51
- COMe-cDC2 / Connectors 52
- 6.2.3 Connector X1A Row B 53
- 6.2.4 Connector X1B Row C 55
- 6.2.5 Connector X1B Row D 57
- 7 BIOS Operation 59
- 7.3 Setup Guide 60
- 7.4 BIOS Setup 62
- 7.4.2 Module Info 63
- Module Software Revisions 64
- Current LVDS Configuration 64
- 7.4.3 Advanced Menu 65
- CPU Configuration 66
- IDE Configuration 67
- IDE Device Submenu 68
- SuperIO Configuration 69
- ACPI Settings 70
- ACPI Cooling Options 71
- PCI Express Configuration 73
- USB Configuration 74
- COMe-cDC2 / BIOS Operation 75
- Hardware Health 76
- Module Hardware Health 77
- Baseboard Hardware Health 78
- Miscellaneous Settings 79
- MARS Interface Configuration 80
- Watchdog 81
- Remote Access Configuration 82
- LAN Controller 83
- GPIO Level Configuration 84
- Trusted Computing 85
- 7.4.4 PCIPnP Menu 86
- 7.4.5 Boot 87
- Boot Setting Configuration 88
- 7.4.6 Security 89
- 7.4.7 Chipset 90
- North Bridge Configuration 91
- Display Control 92
- Internal LVDS Configuration 93
- Southbridge Configuration 94
- LPC Decode Range 95
- 7.4.8 Exit Menu 96
- Corporate Offices 97
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